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POLISHING SOLUTIONS,
HELPING YOUR LAB TO SHINE!

ULTRA TEC designs, manufactures and provides advanced surface & sample prep equipment and consumables for both routine and custom applications in a multitude of research and industrial settings.

ApplicationsEquipment Consumables

Markets & Applications We Serve...

Decapsulation

Removal of electronic packing materials - primarily to gain access to the chip inside - is necessary for many reasons including failure analysis, electrical testing, counterfeit prevention and QC.
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FIBER OPTICS

ULTRA TEC provides a leading range of polishers to the fiber optic industry -- from manual polishing and low production of single patchcords, through 'in the field' polishing, right up to mass production on our new FIBERTEC machine.
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ELECTRONIC FAILURE ANALYSIS

ULTRA TEC offers the industry's widest range of sample preparation equipment to assist the electronic engineer in tackling problems head-on.
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COUNTERFEIT PREVENTION

Counterfeit products are entering the marketplace through increasingly sophisticated methods. These products jeopardize the entire supply chain and already cost the electronics industry many millions of dollars each year.
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SEMICONDUCTORS

Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies.
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Bare Fibers

ULTRA TEC has developed both products and techniques for providing support to the generally fragile bare fiber during lapping and polishing, which can achieve the results required for most bare fiber requirements.
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OPTICS & ELECTRO OPTICS

The requirement of to produce optical surfaces that transmit light correctly is widespread through Industry. ULTRA TEC has had a wide involvement with clients requiring generally flat surfaces on smaller optical sub-assembly components.
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MATERIALS SCIENCE

Cutting and Polishing is widespread throughout industry and research. ULTRA TEC offers a wide range of precision surface and sample preparation equipment to meet the challenge.
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MEDICAL

Medical devices such as endoscopes, arthroscopes and many others require controlled transmission of light for success in their end use. ULTRA TEC’s equipment achieves the highest quality polished surfaces on optic, electro-optic and fiber optic components.
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CHIP-OFF FOR DIGITAL FORENSICS

Chip-Off is an important technique for digital forensics labs that need to access data from mobile devices, such as cellphones and tablets by matter subtraction.
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EQUIPMENT

Browse Our Selection Of Precision Equipment

  • ARC-lite

    Antireflective Coating System For Backside Analysis
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    • Fast and convenient – 45 second process
    • Up to 30% more transmitted photon efficiency
    • Up to 60% improved contrast under NIR
    • Inexpensive to own and operate
    • Bench-top, quiet, room temp. process
    • All package types and sizes
    • RC can be done ‘in-house’ – NO BAKING
    • Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
    Learn More QUOTE Add to cart

  • ASAP-1®

    Analog Selected Area Preparation System
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    • Suits most sizes of die
    • Low damage patented floating-head polishing method allows for extremely thin samples
    • Mechanical Decapsulation
    • Intuitive and easy to use
    • Enables layer by layer topside removal for de-processing
    • Short set-up and process times
    • Easy ‘on the fly’ tilt adjustment.
    Learn More QUOTE Select options

  • ASAP-1® IN SITU

    5-Axis CNC Mill for Selected Area Sample Preparation
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    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
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  • ASAP-1® IPS

    Digital Selected Area Preparation System
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    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • Live Process Video
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
    • Floating Head provides a true polishing action
    Learn More QUOTE Select options

  • ULTRAPOL Basic

    Manual Lapping & Polishing Machine
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    • Cost-effective manual polisher
    • High Torque mechanism
    • In-built coolant system
    • Can be used with manual tools
    • Upgradeable with Long Arm Positioner
    • High Quality Build
    Learn More $3,958.00 Select options

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