Counterfeit Prevention

Counterfeit products are entering the marketplace through increasingly sophisticated methods. These products jeopardize the entire supply chain and already cost the electronics industry many millions of dollars each year. Fortunately, cost-effective  solutions are at hand that enable rapid and consistent visibility of the decapsulated die — allowing the parts supplier an upper hand in attacking the problem of counterfeit avoidance head on.

THE SOLUTION: INCREASED VIGILANCE THROUGH INCREASED TESTING!

ULTRA TEC offers a wide selection of products to enhance every electronic component suppliers’ toolkit for spotting counterfeit devices.

Blue Mill provides a cost-effective benchtop Pre-cavitation – preparing for final decap with plasma or chemical methods. For even higher accuracy requirements — – our ASAP-1®  offers advanced angular alignment for highest reproducibility chip access results. 

SERVING BUSINESSES LARGE & SMALL

For larger electronics industry businesses – with test floors, analytical and QC laboratories – the addition of equipment is generally a known ongoing business expense.

For smaller businesses such as Specialist Component Warehouses or OEM suppliers (that supply the larger entities), the decision to add decapsulation equipment  is potentially one of investing in a first piece of equipment. Don’t worry, we can help you! 

ULTRA TEC has worked for many years with all types of customer. We offer the component industry’s most cost-effective equipment and we can even complete DECAP LAB SOLUTIONS or offer suggestions of appropriate fume hood and safety equipment, and offer applications education to achieve the most effective results.

DE-LIDDING HERMETIC SEALS

For ceramic componenets and packages and modules with metal hermetic seals, our ULTRASLICE Precision Saw offers an unique ‘Z Spindle’ which allows ‘rapid on the fly’ height changes to allow the user to get to the die fast. 

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Our Solutions Include...

  • ASAP-1®

    Analog Selected Area Preparation System
    • Suits most sizes of die
    • Low damage patented floating-head polishing method allows for extremely thin samples
    • Mechanical Decapsulation
    • Intuitive and easy to use
    • Enables layer by layer topside removal for de-processing
    • Short set-up and process times
    • Easy ‘on the fly’ tilt adjustment.
    Learn More QUOTE Select options
  • Blue Mill

    Milling, Chip-off and IC Pre-Cavitation Machine
    • Complete Solution – NO COMPUTER REQUIRED!
    • No programming or ‘G-Coding’ experience required
    • Great milling results for users of all experience levels
    • Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
    • Cold Chip-off for Digital Forensics of NAND Flash
    • Extremely Compact Footprint
    • For the budget conscious user who needs industry-proven results
    Learn More QUOTE Select options
  • ULTRASLICE Compact

    Versatile Precision Saw for Small workspaces & small budgets
    • Versatility – The system handles samples of most shapes, sizes and orientations.
    • Cutting Accuracy – precision lead screws on all feed directions
    • Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
    • Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
    • Most Blade Types – a wide range of diamond and abrasive blades is available.
    Learn More QUOTE Select options

Our Decapsulation Products Include

  • ASAP-1®

    Analog Selected Area Preparation System
    • Suits most sizes of die
    • Low damage patented floating-head polishing method allows for extremely thin samples
    • Mechanical Decapsulation
    • Intuitive and easy to use
    • Enables layer by layer topside removal for de-processing
    • Short set-up and process times
    • Easy ‘on the fly’ tilt adjustment.
    Learn More QUOTE Select options
  • ASAP-1® IN SITU

    5-Axis CNC Mill for Selected Area Sample Preparation
    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
    Learn More QUOTE Select options
  • ASAP-1® IPS

    Digital Selected Area Preparation System
    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • Live Process Video
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
    • Floating Head provides a true polishing action
    Learn More QUOTE Select options
  • Blue Mill

    Milling, Chip-off and IC Pre-Cavitation Machine
    • Complete Solution – NO COMPUTER REQUIRED!
    • No programming or ‘G-Coding’ experience required
    • Great milling results for users of all experience levels
    • Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
    • Cold Chip-off for Digital Forensics of NAND Flash
    • Extremely Compact Footprint
    • For the budget conscious user who needs industry-proven results
    Learn More QUOTE Select options