Jim Colvin contributes two chapters regarding Sample Preparation to the Microelectronics Failure Analysis Desk Reference (7th Edn)

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ULTRA TEC is pleased to announce that Engineering Consultant, Jim Colvin – working in part with his son, Christopher – has contributed two significant chapters to the recently published 7th Edition of ASM’s “Microelectronics Failure Analysis Desk Reference”. Long established as the touchstone for electronic FA professional, the new edition looks set to carry on this tradition. The publication is …

Top Surface Profile Scanning Now Available for improved Device Thinning & Precision Decap

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A new physical-contact Top Surface Scanning mode joins the feature set on ULTRA TEC’s ASAP-1 IN SITU Selected Area Prep System. Top Surface Scanning proves especially advantageous for when removing distinct successive material layers within semiconductor packages — such as multi-die stacks — where dies often need to be individually mapped to ensure resultant decapsulation success. Top Surface Scanning, moreover, …

Interactive Graphics for IC Sample Prep

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ULTRA TEC Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station. The new software tools enable profiling and processing of curved and warped surfaces seen in the wide array of today’s packaged IC devices. These new adaptive techniques build on ASAP-1 In Situ’s unique built-in through-thickness …

ISTFA 2018 – Color Images – First Place Winner

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ULTRA TEC (Santa Ana, CA) are pleased to announce that 1st Place in the Color Images Category in the EDFAS 2018 Photo Competition was won by Tim Hazeldine, VP Sales & Marketing. —————- The image entitled “The Fire Inside” is shown below: “The Fire Inside — Visible light-illuminated view of a backside ultrathinned flip chip, showing emerging circuitry”. — ISTFA 2018 —— …

Extended Range of Tools for ASAP-1 Sample Preparation Products

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ULTRA TEC Manufacturing, Inc. is pleased to introduce a new extended range of tools for its popular ASAP-1 Selected Area Preparation Product line, including both 8mm and 12mm diameter diamond tools for processing large dice and substrate surfaces. The move to a ‘one-piece’ design improves both concentricity and product consistency. Tools are available for the processing of the full range …

50th Anniversary Ad for Technical Journals

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This year ULTRA TEC Manufacturing, Inc. celebrates 50 years of business. Over this time we’ve seen the birth and growth of a number of high-tech industry sectors. We’ve supplied sample prep equipment to most of them. We’ve helped engineers, reverse engineers, space scientists, smart card companies, game designers, police forces, service labs, and product developers not only to “Do their thing”but …

New TEC Note: A Straightforward Guide to the Preparation of Curved and Warped IC’s

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ULTRA TEC announces the publishing of a new TEC Note entitled ‘A Straightforward Guide to the Sample Preparation of Curved and Warped IC’s’. The publication describes techniques developed over many years to assist all users in achieving great backside thinned & polished samples for failure analysis.    Much information has been written over recent years about how the rapid change in …