Semiconductors

Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies. ULTRA TEC has given particular attention to supplying products that span the wide application range, from systems for preparing silicon, gallium arsenide (GaAs) etc, nanotechnology, MEMS, and devices to supplying advanced flat lapping and precision sawing equipment for back lapping (or back grinding).

For single die and package-level preparation, ULTRA TEC offers  a numbers of precision lapping and polishing machines and milling-based approaches which offer advanced functionality for working with package warpage and stress, and offer electronic end-pointing for removing a precise amount of material.


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Our Solutions Include...

  • MULTIPOL Advance

    True Flat Lapping And Polishing Machine
    • TRUE FLAT LAPPING – The fully-controllable reciprocating arm mechanism allows maintenance of plate flatness
    • VERSATILITY – Polishing techniques possible including abrasive, diamond, slurry, CMP and etch polishing
    • EASE OF CLEANING – Simple detachment of all components which may cause contamination – downtime is minimized
    • SAMPLE HOLDING – The system accepts precision jigs for the very highest accuracies to be attained
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  • ULTRAPOL Advance

    Flat Lapping and Polishing Machine
    • Better processing results –  ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
    • Fast & repeatable alignment  – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
    • Slurry polishing –  A recirculating pump may be added, in addition to the standard water coolant system. 
    • Avoids cross-contamination –  The unique slurry / drip tray concept allows convenient removal and cleaning
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  • ULTRAPOL End & Edge

    Flat And Angled Preparation Of Optical, Electronic & Materialographic Components
    • Fully Angle adjustable – produces specific wedge angles
    • Quick Release Interface allow for fast and repeatable mounting and demounting.
    • Holders available for most components
    • Fast process times
    • Low run-out lap for flat optical polishes
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  • ULTRASLICE

    Versatile Precision Saw with Z-Spindle
    • Z-Spindle –  Allows for cutting depth to be altered even during operation
    • Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
    • Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
    • Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
    • Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
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  • ULTRASLICE Compact

    Versatile Precision Saw for Small workspaces & small budgets
    • Versatility – The system handles samples of most shapes, sizes and orientations.
    • Cutting Accuracy – precision lead screws on all feed directions
    • Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
    • Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
    • Most Blade Types – a wide range of diamond and abrasive blades is available.
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Our Decapsulation Products Include

  • ASAP-1®

    Analog Selected Area Preparation System
    • Suits most sizes of die
    • Low damage patented floating-head polishing method allows for extremely thin samples
    • Mechanical Decapsulation
    • Intuitive and easy to use
    • Enables layer by layer topside removal for de-processing
    • Short set-up and process times
    • Easy ‘on the fly’ tilt adjustment.
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  • ASAP-1® IN SITU

    5-Axis CNC Mill for Selected Area Sample Preparation
    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
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  • ASAP-1® IPS

    Digital Selected Area Preparation System
    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • Live Process Video
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
    • Floating Head provides a true polishing action
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  • Blue Mill

    Milling, Chip-off and IC Pre-Cavitation Machine
    • Complete Solution – NO COMPUTER REQUIRED!
    • No programming or ‘G-Coding’ experience required
    • Great milling results for users of all experience levels
    • Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
    • Cold Chip-off for Digital Forensics of NAND Flash
    • Extremely Compact Footprint
    • For the budget conscious user who needs industry-proven results
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